Bayside Design Inc
(BDI) was founded in 2002 to provide the most comprehensive high-speed
engineering design, modeling, analysis, measurement, characterization
and verification services and solutions.
BDI is a leading supplier focused on providing High Speed Design and
Verification Services and Solutions. BDI was formed by ex-Velio Communications
Inc (product team sold to LSI Logic, Inc and the IO team to RAMBUS),
founding engineers with collective working experience of over 150+.
We have over 100 leading edge customers comprising of Silicon Vendors,
Fabless Semiconductor Companies, Fortune 500 companies and many Startup
companies. We have executed over 150 projects and all of them have been
first pass success and we can provide you with our customer successes
and references under NDA. We are utilizing our knowledge and expertise
to develop unique IP and products which enables us to provide comprehensive
verification services and solutions.
majority of the customers we serve are leading IP providers or leading
edge technology companies in Compute, Storage, Communication, RF and
Consumer markets. In each of these markets companies are adapting the
newer standards based on Multi Giga Hertz (MGHz) serial interfaces,
higher speed parallel interfaces such as DDRII & DDRIII and WiMAX.
Convergence of products in these markets demand greater level of integration,
which in turn is forcing companies towards smaller geometries and coupled
this with higher performance and lower power requirements is causing
tremendous Signal Integrity (SI) and verification challenges. So to
protect their millions of dollars of investment and to manage the risk
and schedules these companies are partnering with companies like BDI
for their design and verification needs. The overall market is quite
large and is growing as companies migrate to 45nm and smaller geometries.
We offer a number of engineering design services and they are listed
Signal Integrity and Power Integrity services for IC packages and
BGA package selection,
design, modeling and analysis starting right from pad placement allocation/tradeoff
for optimum P/G to Signal assignment, to stack-up analysis and routing
strategy to de-coupling planning and all the way to package sign-off.
WiMAX package design,
modeling and analysis to accommodate the emerging convergence of GPS,
Bluetooth, Wi-Fi, Cellular and Mobile TV.
& load board design: This includes schematic capture, layout,
signal and power integrity analysis. We also provide board fab, source
the parts and assemble the board. We will verify the impedances and
also power-on the board to see that everything is ready to go.
We have an advanced
state of the art measurement lab. We offer a variety of Microwave
modeling/measurement/characterization and High Speed Serial IO characterization
level simulation support for channel analysis (from TX to RX, encompassing
the entire link with all components) for pre and post scenarios.
Modeling- We can
create accurate IBIS models as well as advanced behavior models which
can run 10 to 100 times faster then transistor based models within
5% accuracy. In addition we can develop variety of package models
ranging from distributed lumped to hybrid to high performance broadband
Design Kit services
to develop advanced behavior models, encrypted models, deriving design
rules for board level device implementation and documentation. This
is very useful to jumpstart your customers so that they can focus
on getting the product to volume production.
In addition we also
develop interface compliance kits for back-end interoperability, compliance
verification and also provide custom SW solutions.
We offer a very flexible business engagement model and we work either
on a project basis or on hourly basis. Our experienced team will work
very closely with your team to provide expertise for the above-mentioned
services to get the job done quickly and efficiently. In addition, we
will leverage our relationships with package assembly/substrate vendors
and leading edge board manufacturers as well as assembly vendors to
deliver the best solution and the lowest possible cost.